Our History
We started TeraProbes, Inc. in 2014 as a spin-off from our research at the Electrical and Computer Engineering Department at The Ohio State University. We believe our non-contact probing technology can help alleviate pains in the high-speed electronics industry associated with contact probe wear & tear, contact repeatability, and extremely-high hardware and operation costs associated with on-wafer device and IC characterization.
Our Mission
Fully automated probing of electronic materials, devices and integrated circuits for high frequency applications (30GHz to 1.1THz and above).
Our Specializations
Fully-automated Non-Contact On-wafer Probing Systems
High Frequency Antenna Design
THz Characterization