Below is a list of selected papers on TeraProbes’ core technology. If you are interested in receiving additional information, please contact us at contact@teraprobes.com.
Sub-millimeter-Wave Equivalent Circuit Model for External Parasitics in Double-Finger HEMT Topologies.
Authors: Y. Karisan, C. Caglayan and K. Sertel, in Journal of Infrared, Millimeter, and Terahertz Waves, June 2017
On-Chip “Baluntennas” for Differential-Mode Non-Contact Characterization of mmW/THz Devices and ICs.
Authors: C. Caglayan and K. Sertel, in Antennas and Propagation Society International Symposium (APSURSI), June 2016
Lumped-element equivalent circuit modeling of millimeter wave HEMT parasitics through full-wave electromagnetic analysis.
Authors: Y. Karisan, C. Caglayan, G. C. Trichopoulos, and K. Sertel, in IEEE Transactions on Microwave Theory and Techniques, vol. 64, no. 5, pp. 1419-1430, May 2016
Non-contact differential-mode on-wafer device characterization in the mmW and THz bands.
Authors: C. Caglayan and K. Sertel, in 2016 IEEE MTT-S International Microwave Symposium (IMS), San Francisco, CA, 2016
Non-contact probes for on-wafer characterization of sub-millimeter-wave devices and integrated circuits.
Authors: C. Caglayan, G. C. Trichopoulos, and K. Sertel, in IEEE Transactions on Microwave Theory and Techniques, vol. 62, no. 11, pp. 2791-2801, Nov. 2014
Accuracy and repeatability of automated non-contact probes for on-wafer characterization.
Authors: C. Caglayan, G. C. Trichopoulos, and K. Sertel, in Microwave Measurement Conference (ARFTG), 2014 84th ARFTG, Boulder, CO, 2014